White Paper: Future-Ready Cooling Solutions and Easy Service Design for AI Training Systems
Air cooling is the traditional way to remove heat generated from processing units by directing cool air through hot surfaces to dissipate heat.
White Paper: OAI System Liquid Cooling Guidelines
This document is not a specification for OAI/OAM products. It is a set of guidelines on the design, validation, and implementation of liquid cooling...
White Paper: Modular Design Implementation on Edge Server
With the ever-growing demand for faster and more reliable transmissions, data centers need to be consistently aware of different architectures and...
1 min read
White Paper: Wiwynn 5G Solution in Smart Factory
The new communication standard does not only offer the 5G connectivity for people, but also for the sensors, devices, and machines on the Internet of...
White Paper: OCP Liquid Cooling Integration and Logistics White Paper
This whitepaper outlines guidance for liquid cooling integration and logistics when deploying liquid cooled Information Technology Equipment (ITE)...
Wiwynn 5G Solution for O-RAN DU and CU Architecture
In November 2020, Wiwynn partnered with Radisys to participate in the Second Global O-RAN Alliance Plugfest for multi-vendor interoperability test....
OCP ACS Immersion Cooling
The OCP ACS (Advanced Cooling Solution) is a sub-project under the OCP Rack & Power Project. The Immersion sub-project enables community driven...
OpenRMC Design Specification
The OpenRMC Sub-Project is under the direction of the OCP Hardware Management Project Group and creates designs and specifications to enable...
Analysis of Cold Plate Matrix in Rack-level Liquid Cooling System
Cooling for data center is becoming more and more challenging as the power of processing units increases significantly. Liquid cooling would be one...