White Paper: High-Power Double-Wide Rack
This white paper presents a complete design and validation framework for next-generation high-power double-wide racks.
1 min read
White Paper: An All-to-All CPO System Architecture
This white paper presents a system-level perspective on how CPO technology can be integrated into scalable AI server architectures. It first introduces the key CPO building blocks, with a focus on their functions, interconnections, and system-level implications.
1 min read
White Paper: Advancing Vertical Power Delivery
As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and next-generation data center processors—the current required to power a single chip has grown from tens of amps to over 1000A, while core operating...
1 min read
White Paper: Breaking the Thermal–Hydraulic Trade-Off: A Non-Uniform Straight-Microchannel Cold Plate for High-Heat-Flux Cooling
This study proposes a heat-flux-based non-uniform straight-microchannel cold plate design for non-uniform chip heat loading. A preliminary parametric analysis at a fixed open-area ratio of 50% showed that reducing the wall thickness and channel gap below 80/80 μm caused a sharp increase in pressure...
White Paper: System Integration and Deployment Considerations for CPO-Based AI Scale-Up Infrastructure
The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power efficiency. Co-Packaged Optics (CPO) offers a path toward larger AI scale-up domains by enabling high-density optical connectivity beyond conventional...
1 min read
White Paper: From Material Composition to Effective Thermal Conductivity: A Physics-Based Method for Improving Thermal Simulation Accuracy
Accurate PCBA thermal simulation is critical for high-power, high-density AI and accelerator systems. Modern liquid- and hybrid-cooled servers integrate densely arranged power components that generate significant heat. During early-stage development, however, detailed vendor thermal models for...
1 min read
White Paper: System-Level Design Principles for Liquid-Cooled Server Platforms
As AI and high-performance computing (HPC) workloads continue to increase rack power density beyond the practical limits of conventional air cooling, liquid cooling has become a key technology for next-generation server platforms.
1 min read
White Paper: CAE-Assisted Cable Routing Methodology for High-Density Server Platforms
As AI server systems continue to scale rapidly in power and data throughput, cable density within server platforms has increased significantly. High-density cable designs introduce critical challenges, including signal integrity, assembly feasibility, and airflow efficiency, which become...
1 min read
White Paper: A Guideline for Direct Liquid Cooling Testing Platform
As server power density continues to increase in modern AI and high-performance computing applications, direct liquid cooling (DLC) has become a critical thermal management solution for next-generation data centers.