White Paper: High-Power Double-Wide Rack
This white paper presents a complete design and validation framework for next-generation high-power double-wide racks....
Advanced Thermal & Mechanical
Rethinking Infrastructure: Empowering Hyperscale AI with Advanced Thermal Engineering
Engineering Beyond Thermal Limits: Integrated System Architecture
Next-Gen Liquid Cooling & Intelligent Management
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Scalable Integrated Architecture：
Precision-engineered cold-plate cooling optimized for ultra-high TDP AI accelerators. Designed for maximum compute density while ensuring seamless field-serviceability and modular scalability. -
Mission-Critical Proactive Safety：
Multi-layer leak detection with millisecond-latency telemetry. Real-time rack-level alerting mitigates operational risk, ensuring continuous uptime and SLA-grade reliability. -
UMS：
Intelligent Infrastructure Orchestration
Centralized monitoring of flow, thermal gradients, and pressure dynamics via standardized, DCIM-ready interfaces for peak operational transparency and efficiency.
Dual-Sided Cold Plate & Microchannel Innovation
Wiwynn’s Double-Sided Cold Plate technology redefines thermal management for high-power-density silicon. By simultaneously cooling high-power AI chips on the top side and vertical power delivery components on the bottom side, it supports total thermal loads exceeding 4 kW within a compact form factor.
We continue to adopt advanced manufacturing approaches to enable the design and fabrication of high-precision microchannel structures tailored to actual chip heat distribution. Compared to conventional architectures, this approach significantly enhances thermal performance, supports heat fluxes beyond 350 W/cm², and delivers an optimal balance between silicon performance and long-term system reliability.
Air-Assisted Liquid Cooling Solution
Wiwynn’s AALC solutions provide a bridge to liquid cooling without requiring immediate facility-level infrastructure overhauls. We enable rapid, rack-level AI deployment into existing air-cooled environments, maintaining peak compute performance while balancing TCO and performance-per-watt.
As a key OCP player, we’ve published white papers on cooling and management at OCP and our global site. Download the technical details here:
