Advanced Thermal & Mechanical    

Engineering Beyond Thermal Limits: Integrated System Architecture  

Next-Gen Liquid Cooling & Intelligent Management

• Scalable Integrated Architecture：
  Precision-engineered cold-plate cooling optimized for ultra-high TDP AI accelerators. Designed for maximum compute density while ensuring seamless field-serviceability and modular scalability.

• Mission-Critical Proactive Safety：
  Multi-layer leak detection with millisecond-latency telemetry. Real-time rack-level alerting mitigates operational risk, ensuring continuous uptime and SLA-grade reliability.

• UMS：
  Intelligent Infrastructure Orchestration
  Centralized monitoring of flow, thermal gradients, and pressure dynamics via standardized, DCIM-ready interfaces for peak operational transparency and efficiency.

Dual-Sided Cold Plate & Microchannel Innovation 

Wiwynn’s Double-Sided Cold Plate technology redefines thermal management for high-power-density silicon. By simultaneously cooling high-power AI chips on the top side and vertical power delivery components on the bottom side, it supports total thermal loads exceeding 4 kW within a compact form factor.

We continue to adopt advanced manufacturing approaches to enable the design and fabrication of high-precision microchannel structures tailored to actual chip heat distribution. Compared to conventional architectures, this approach significantly enhances thermal performance, supports heat fluxes beyond 350 W/cm², and delivers an optimal balance between silicon performance and long-term system reliability.

In‑house double‑wide Rack platform     

• Ruggedized Hyperscale Foundation：
  A reinforced, anti-sagging chassis engineered for the mechanical stresses of mass global deployment. This architecture supports high-TDP AI clusters while integrating HVDC power paths and advanced signal integrity to eliminate bottlenecks.

• Tailored for the AI Ecosystem： Fully aligned with OCP (Open Compute Project) ORW and Double-Wide standards to streamline brownfield and greenfield integration. Purpose-built for high-intensity AI training and inference at scale.

• Deployment-Ready Flexibility： From factory-to-datacenter, our co-design and specialized packaging ensure system integrity during transit. Scalable by design, this platform evolves alongside your evolving workload demands.

Air-Assisted Liquid Cooling Solution  

Wiwynn’s AALC solutions provide a bridge to liquid cooling without requiring immediate facility-level infrastructure overhauls. We enable rapid, rack-level AI deployment into existing air-cooled environments, maintaining peak compute performance while balancing TCO and performance-per-watt.

As a key OCP player, we’ve published white papers on cooling and management at OCP and our global site. Download the technical details here: