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White Paper: AI Rack Management with Wiwynn UMS
This paper discusses the rapid expansion of AI workloads and the resulting transformation in data center infrastructure requirements. Traditional...
This whitepaper explores how Wiwynn utilizes innovative molded pulp packaging technology to provide environmentally friendly and protective packaging solutions for server products.
Molded pulp, made from paper, is biodegradable and serves as an effective alternative to traditional plastic packaging such as EPE foam, reducing environmental impact. The material offers strong structural support, verified through vibration, drop testing, and finite element analysis to ensure safety during transportation.
Looking ahead, Wiwynn aims to enhance the water resistance of molded pulp and streamline production costs. The company also foresees the continuous evolution of molded pulp packaging, with innovations in material composition and design that will further contribute to sustainable packaging solutions for server products.
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1 min read
This paper discusses the rapid expansion of AI workloads and the resulting transformation in data center infrastructure requirements. Traditional...
1 min read
Firmware updates are essential for the BMC system. Each device requires a unique update flow and utilizes different transport protocols, such as I2C...
1 min read
AI clusters using next-generation accelerators (e.g., NVIDIA GB200) push rack power density beyond 130 kW, making air cooling insufficient and...