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White Paper: Advancing Vertical Power Delivery
As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
Wiwynn
Updated on July 26, 2024
Impedance matching in trace design may lead to problems such as signal reflections, crosstalk, and dissipation, which can affect the overall system performance and reliability. In design and manufacturing processes, characteristic impedance is prominent in even the slightest variations of any factors, which can deviate the intended impedance value, potentially resulting in unforeseen effects on the product.
Wiwynn conducted a series of experiments and analyzed various factors under proper process control. Based on the experimental results, it can be observed that the lateral etching amount of traces is influenced by copper spacing and thickness.
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As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
1 min read
This study proposes a heat-flux-based non-uniform straight-microchannel cold plate design for non-uniform chip heat loading. A preliminary parametric...
The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power...