White Paper: The Finite Element Analysis Methodology for Printed Circuit Board Assembly

White Paper: The Finite Element Analysis Methodology for Printed Circuit Board Assembly
White Paper: The Finite Element Analysis Methodology for Printed Circuit Board Assembly
0:46

Traditional approaches, such as Trace Mapping FEA, often encounter significant challenges due to uncertainties in material properties and high computational costs. This whitepaper introduces Wiwynn's innovative Hybrid FEA method, which integrates experimental data from three-point bending tests with numerical simulations to more accurately and efficiently determine material properties.

The Hybrid FEA method has proven effective in evaluating risks such as DIMM insertion stress, solder ball cracking, and power pin mounting deformation. Case studies demonstrate that the Hybrid FEA method delivers results comparable to traditional methods while significantly reducing computational demands.

Register to Download the whitepaper!

 

White Paper: The Lightweight Patterned Reinforced Chassis In Server Product

1 min read

White Paper: The Lightweight Patterned Reinforced Chassis In Server Product

This research presents an innovative approach to reducing server weight by replacing conventional thick chassis structures with thinner alternatives....

Read More
White Paper: Platform Root of Trust Application on Intel Server

White Paper: Platform Root of Trust Application on Intel Server

The white paper focuses on Wiwynn's implementation of Intel's Platform Firmware Resilience (PFR) in server systems, based on the NIST SP 800-193...

Read More
White Paper: Study of Jet Impinging and Integrated Cold Plate for Unleashing Chipset Power

1 min read

White Paper: Study of Jet Impinging and Integrated Cold Plate for Unleashing Chipset Power

As thermal design power (TDP) for modern processors such as CPUs, GPUs, and TPUs exceeds 1 kW, traditional air cooling methods are proving...

Read More