White Paper: The Finite Element Analysis Methodology for Printed Circuit Board Assembly

Picture of Wiwynn Wiwynn July 19, 2024

Whitepapers
White Paper: The Finite Element Analysis Methodology for Printed Circuit Board Assembly
White Paper: The Finite Element Analysis Methodology for Printed Circuit Board Assembly
0:46

Traditional approaches, such as Trace Mapping FEA, often encounter significant challenges due to uncertainties in material properties and high computational costs. This whitepaper introduces Wiwynn's innovative Hybrid FEA method, which integrates experimental data from three-point bending tests with numerical simulations to more accurately and efficiently determine material properties.

The Hybrid FEA method has proven effective in evaluating risks such as DIMM insertion stress, solder ball cracking, and power pin mounting deformation. Case studies demonstrate that the Hybrid FEA method delivers results comparable to traditional methods while significantly reducing computational demands.

Register to Download the whitepaper!

 
White Paper: CAE-Assisted Cable Routing Methodology for High-Density Server Platforms

1 min read

White Paper: CAE-Assisted Cable Routing Methodology for High-Density Server Platforms

As AI server systems continue to scale rapidly in power and data throughput, cable density within server platforms has increased significantly....

Read More
White Paper: A Guideline for Direct Liquid Cooling Testing Platform

1 min read

White Paper: A Guideline for Direct Liquid Cooling Testing Platform

As server power density continues to increase in modern AI and high-performance computing applications, direct liquid cooling (DLC) has become a...

Read More
White Paper: Introduction to SPDM Attestation between BMC and EROT on AI server

White Paper: Introduction to SPDM Attestation between BMC and EROT on AI server

This whitepaper introduces SPDM attestation between a BMC and an External Root of Trust (EROT) on AI servers. It outlines SPDM prerequisites and the...

Read More