White Paper: Anti-tilt Mechanism for Bare Die CPU

The bare die CPU, as an innovative product design, offers significant advantages over traditional designs across various stages, including product application, assembly, and production.

Traditionally, heat sinks are secured by tightening screws one by one at each corner. However, this method can apply excessive pressure on the bare die, potentially leading to chip damage. In our efforts to develop an anti-tilt mechanism for bare die CPUs, experiments confirmed that the new mechanism reduces uneven contact during heat sink installation, thus preventing chip damage during assembly. Overall, the anti-tilt mechanism design enables easier installation while providing enhanced chip protection.

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