Press

Wiwynn 5G Solution for O-RAN DU and CU Architecture

In November 2020, Wiwynn partnered with Radisys to participate in the Second Global O-RAN Alliance Plugfest for multi-vendor interoperability test. The solution includes a disaggregated 5G sub-6 GHz O-RAN O-DU and an O-CU and adopts Intel® FlexRAN fronthaul transportation reference architecture.

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OCP ACS Immersion Cooling

The OCP ACS (Advanced Cooling Solution) is a sub-project under the OCP Rack & Power Project. The Immersion sub-project enables community driven activities focused on facilitating OCP and industry progression of immersion cooling. Within the Rack and Power ACS group, this project also facilitates...

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OpenRMC Design Specification

The OpenRMC Sub-Project is under the direction of the OCP Hardware Management Project Group and creates designs and specifications to enable interoperable manageability for Open Rack managers.

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Analysis of Cold Plate Matrix in Rack-level Liquid Cooling System

Cooling for data center is becoming more and more challenging as the power of processing units increases significantly. Liquid cooling would be one of the solutions to meet this upcoming high-power demand for its ability to maintain high cooling efficiency.

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AI Inference Optimization on OCP openEDGE Platform

Looking for Edge AI Server for your new applications? What’s the most optimized solution? What parameters should take into consideration? Come to check Wiwynn’s latest whitepaper on AI inference optimization on OCP openEDGE platform.

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Open System Firmware Development on OCP Platform

The OCP Open System Firmware (OSF) project is aiming to allow the system firmware (also known as BIOS) to be modified and shared by the owners OCP Open System Firmware Project. From March 2021, supporting OSF is mandatory for servers with OCP badging. Some ecosystem partners have decided to...

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Optimize Your NFVI Performance with Wiwynn EP100 and Intel Speed Select Technology – Base Frequency

Wiwynn® EP100 design is optimized for CoSPs’ NFVI with flexibility, serviceability and performance. CoSPs can utilize their existing racks with flexible configuration of the 1U half-width single socket sled.

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Two Phase Rack Level Liquid Cooling Solution

The power consumption of computing silicon, such as CPU and GPU, continues to push envelope of existing thermal solutions in IT technology. The demands of the thermal technologies for IT gears are not satisfied by functioning solutions only. High power efficiency is usually deterministic to the...

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High Performance/Scalability Compute Accelerator with Latest PCIe Gen4 Technology

The fast development of AI deep learning and HPC applications increases demands for high performance and high scalability computing solutions to accelerate model training and data processing. To address the fast-growing market, Wiwynn unveiled the industry’s first PCIe Gen 4 enabled 4U...

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