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AI and large-language-model clusters are straining the limits of traditional fat-tree and star networks. When tens of billions of parameters move across 224 Gbps links, the switch tiers, cable count, and power draw all climb sharply. Our newest white paper explains how a 3D Torus rack-level fabric...
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AI accelerators and next-gen HPC processors are already nudging past the one-kilowatt mark, making single-phase liquid loops struggle with soaring flow rates, pump power, and rack-level energy budgets. Our latest white paper reveals how a two-phase cold plate, tuned for a 45 °C boiling point,...
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Demand for more servers is climbing fast and every extra kilogram of steel increases cost, shipping emissions, and rack loading. Our latest white paper explains how a patterned embossing technique lets a thinner server chassis match the stiffness of thicker sheet metal while trimming weight and...
The white paper focuses on Wiwynn's implementation of Intel's Platform Firmware Resilience (PFR) in server systems, based on the NIST SP 800-193 guidelines. It explores both hardware and firmware aspects of PFR, highlighting how these solutions enhance system security by detecting and mitigating...
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As thermal design power (TDP) for modern processors such as CPUs, GPUs, and TPUs exceeds 1 kW, traditional air cooling methods are proving insufficient. Liquid cooling, particularly using cold plates, has emerged as a superior solution. This paper from Wiwynn introduces an advanced cold plate...
The integration of advanced liquid cooling systems in AI clusters is essential for maintaining thermal stability and optimizing performance. Key components such as AI racks, Cooling Distribution Units (CDUs), the Wiwynn UMS100 (Universal Management System), and AMI DCM (Data Center Manager) work...
This whitepaper explores how Wiwynn utilizes innovative molded pulp packaging technology to provide environmentally friendly and protective packaging solutions for server products. Molded pulp, made from paper, is biodegradable and serves as an effective alternative to traditional plastic packaging...
The bare die CPU, as an innovative product design, offers significant advantages over traditional designs across various stages, including product application, assembly, and production. Traditionally, heat sinks are secured by tightening screws one by one at each corner. However, this method can...
Impedance matching in trace design may lead to problems such as signal reflections, crosstalk, and dissipation, which can affect the overall system performance and reliability. In design and manufacturing processes, characteristic impedance is prominent in even the slightest variations of any...