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White Paper: Advancing Vertical Power Delivery
As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
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Wiwynn
Updated on August 4, 2025
This research introduces an innovative immersion cooling testing platform equipped with dedicated fixtures that streamline production and debugging. The system enables efficient fault detection and component replacement, resulting in higher manufacturing yields and expanded production capacity. By optimizing resource utilization, it reduces electricity, water, and coolant consumption—supporting ESG goals while driving down overall manufacturing costs for next-generation AI servers.
With the rapid rise of AI applications, servers must process massive data loads and increasingly powerful chips that generate substantial heat. Traditional air and liquid cooling face mounting challenges in efficiency, cost, and space requirements. Immersion cooling has therefore emerged as a promising solution, yet its testing environments remain limited. This platform addresses that gap by enabling fast signal measurement and early fault identification before formal manufacturing, paving the way for more reliable, sustainable, and cost-effective AI server production.
Download the whitepaper now to see how cutting-edge immersion cooling technologies are redefining the future of scalable, energy-efficient AI data centers.
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As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
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This study proposes a heat-flux-based non-uniform straight-microchannel cold plate design for non-uniform chip heat loading. A preliminary parametric...
The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power...