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White Paper: Advancing Vertical Power Delivery
As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
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Wiwynn
Updated on April 27, 2026
Wiwynn is participating in Intel’s Open IP collaboration program by integrating a 1OU computing server, compliant with the Open Compute Project (OCP) Open Rack V3 (ORv3) standard, into Intel’s purpose-designed single-phase immersion cooling tank. The system employs Perstorp Polyolester (POE) 390z synthetic ester (Synmerse™ DC) as the coolant for thermal performance testing.
To evaluate cooling efficiency, the test subjects the CPU to stress levels reaching a Thermal Design Power (TDP) of 550W, while analyzing the impact of parameters such as Cooling Distribution Unit (CDU) pumping frequency, inlet coolant temperature, and heatsink type. Comparative assessments are conducted between air cooling and single-phase immersion cooling on the same system, aiming to provide insights for optimizing immersion cooling efficiency and advancing high-performance computing and data center thermal management.
Download the whitepaper now to discover how next-generation thermal innovations are unlocking the future of energy-efficient, high-density computing.
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As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
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This study proposes a heat-flux-based non-uniform straight-microchannel cold plate design for non-uniform chip heat loading. A preliminary parametric...
The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power...