White Paper: Innovative Two-Phase Cold Plate Solutions for Future High-Power AI Chips

This white paper presents a comprehensive analysis of a two-phase cold plate cooling solution specifically designed for high-power chips. The system effectively dissipates up to 2.5kW of heat at a boiling point of 45°C, successfully cooling chips with power densities as high as 125W/cm².

One of the key advantages of this solution is its ability to operate efficiently at a low coolant flow rate of 0.85 LPM, compared to the 3 LPM typically required by single-phase cold plates.

In multi-processor testing, the two-phase cold plate demonstrated superior thermal performance, reducing CPU temperature by 13.7°C while eliminating the preheating effects commonly observed in single-phase systems. Additionally, it achieved substantial energy savings by consuming approximately 67% less pump power than its single-phase counterpart.

Register to Download the whitepaper!