White Paper: Analysis of Different Rack-Level Direct-to-Chip Liquid Cooling Solutions

This whitepaper provides an in-depth analysis and investigation of rack-level liquid cooling solutions, including Standalone air-assisted, Liquid-to-liquid CDU, and Hybrid architectures. Key components such as cold plates, quick connectors, manifolds, CDUs, and RDHx units were thoroughly tested for optimal performance.

The testing highlighted the unique cooling capabilities and infrastructure needs of each solution: CDU-only with an 80kW maximum capacity, Hybrid systems delivering 60kW cooling at the lowest PUE via water cooling, and Standalone air-cooled systems capable of 20kW. The choice of system depends on server power density, cooling demands, available infrastructure, and targeted PUE levels. The analysis and results underline the significant advantages of liquid cooling for thermal management in high-density AI server deployments.

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