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White Paper: The Lightweight Patterned Reinforced Chassis In Server Product
This research presents an innovative approach to reducing server weight by replacing conventional thick chassis structures with thinner alternatives....
Press
Oct 12, 2022 6:58:22 PM
Air cooling is the traditional way to remove heat generated from processing units by directing cool air through hot surfaces to dissipate heat.
In recent years, the rapid expansion of AI and HPC is in demand of higher performance in both the processing units and in heat dissipation. Aimed to address the heat dissipation limit of air cooling, liquid cooling is introduced as an advanced cooling method to have coldplate array dissipate heat directly from the processing units.
With significant research into AI training system and other data center applications, we came up with multiple swappable cooling solutions for cooling hot processing units (OCP accelerator module) within the same AI training system. This swappable cooling solution design can provide quick and easy upgrade of cooling in most scenarios.
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1 min read
This research presents an innovative approach to reducing server weight by replacing conventional thick chassis structures with thinner alternatives....
The white paper focuses on Wiwynn's implementation of Intel's Platform Firmware Resilience (PFR) in server systems, based on the NIST SP 800-193...
1 min read
As thermal design power (TDP) for modern processors such as CPUs, GPUs, and TPUs exceeds 1 kW, traditional air cooling methods are proving...