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Ingite the Innovation of Sustainability


Wiwynn at OCP Global Summit 2022

Oct 18–20, Booth A13, San Jose Convention Center


  WATCH ON DEMAND


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Empowering Open


Echoing with OCP theme of this year - Empowering Open, Wiwynn, as one of the active members of the OCP, is going to present our offerings with the theme of “Ignite the Innovation of Sustainability”. We will be showcasing technology workshops around advanced cooling solutions, datacenter hardware for environment sustainability, open hardware to firmware design.

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Leading-Edge Innovation


Hence, we are excited to share with you our latest advanced cooling solution, 2-Phase Immersion Cooling solution plus Wiwynn OAI server, OAI liquid cooling system and OAM 2.0 air cooling system, which are all power efficient and important for environment sustainability. For edge and AI offerings, we have the Open Edge solutions with latest generation of CPU, as well as platforms good for AI edge applications.

Product Showcase

Advanced Cooling Solutions

3 featured technologies for cooling the same OCP AI training server

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2 Phase Immersion Cooling Solution for OAI Server

  • 6KW Heat Rejection with 3KW Demonstrated​
  • Integrated Dry Cooler for Seamless Heat Rejection​
  • 19-inch & 21-inch Compatible, 1000mm deep​
  • 4-RU or 4-OU Compatible
  • Smart Controls and Real-Time Monitoring
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Liquid Cold-Plate Cooling Solution for OAI Server

  • 3OU Liquid Cooling System for 8 x Future 1kW ASIC
  • 4 (in parallel) by 2 (in series) Cold Plate Loop with Balanced Flow Distribution
  • Compatible with ORv3 Blind-mate Interfaces
  • Hose-clip and Chassis Manifold Supporting for Vibration Elimination
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Advanced Air Cooling Solution for OAI Server
 

  • Aggregated AI training system with 2S server processors
  • OCP NIC 3.0 x 2 for NUMA balance
  • Fully connected OAM architecture on UBB
  • 6 x QSFP-DDs 400GbE ports with RDMA for system scale-out
  • Drawer and Front I/O design for Easy Installation and Maintenance

Cloud Solutions

5 featured products

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SV7100G5

The 4U12N Server with Rich Configurations for Scalable Cloud Service
  • 12 x 1U Server Nodes for Scalable Services Inherited from OCP Yosemite v3​
  • Power Efficient Scalable 4U Platform for Flexible Compute, Storage, and Deep Learning Acceleration​
  • 4th Gen Intel® Xeon® Scalable processor​
  • Multi-host OCP 3.0 Shared NIC for Unified System Management
  • Non-stop Operation and Front I/O Service for Easy Installation and Maintenance
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SV7100G4

OCP Yosemite Version 3

Multi-node Server with Rich Configurations for Scalable Cloud Service

  • Up to 12 Server Nodes (1U) for Scalable Services​
  • Power Efficient Scalable 4U Platform for Flexible ​Compute, Storage, and Deep Learning Acceleration​
  • Non-stop Operation and Front I/O Service ​for Easy Installation and Maintenance

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SV/ST7000G4

OCP Grand Canyon

Versatile Storage System for Big Data, Archiving Applications

  • High Density Storage Server with 72 HDDs for One or Two Head Nodes​
  • Diversified Configuration for Various Usages ​including  Storage Expansion JBOD ​
  • SAS-4 24Gbps Interface Doubles ​Interconnection Bandwidth​
  • Redundant Cooling and Hot Swappable ​HDD for High Availability
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SV328R

Ampere® Mt.Jade 2U

ARM Based Server with Powerful and Cost-effective Storage Options

  • Incorporate Powerful Ampere® Altra®, Altra® Max 64-bit Processors​
  • Rich PCIe Device Support and Flexible PCIe Expansion​
  • Offer High Performance of TCO Benefit ​
  • Support High Performance U.2 ​and Cost-effective SAS/SATA SSD  ​
  • Redundant PSU and Fan with High Availability
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SV302A

The AMD® Milan Based 1U2Node Server Powering Cloud Computing
  • Brilliant Combination of Computing Density and Power Efficiency​
  • Universal Enclosure with Modularization for Various Node Configuration​
  • Enhanced Performance for High Computing Applications​
  • Front Access Design to Simplify System Maintenance

Edge Solutions

2 featured products

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EP102

OCP openEDGE Platform

Field Proven All-in-one Platform for 5G CU/DU/5GC/MEC and Private 5G Environment

  • 4th Gen Intel® Xeon® Scalable processor
  • 3U Short-Depth Chassis and Front Service for Edge Computing ​Environment​
  • Flexible Sled Design for Various Sled Options
  • Pooled Power Supply for Energy Efficiency
  • OpenRMC Based System Management
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ES200

Full-Featured Edge

Powerful Edge Solution with Flexible Configuration for Various Edge Applications

  • 2U Short Chassis and Easy Maintenance for Edge Environment​
  • Open Platform, High Speed, and Support Dual OCP NIC 3.0​
  • Flexible Configuration for Computing, Storage​ including AI Inference and NFVi

Speeches

 
Topic Track Speaker Location
Tuesday, Oct 18
2:00pm – 2:25pm

 

Ignite the Innovation of Sustainability
 Executive Track Harold Liu, Lentis Pai 210BF
3:00pm – 3:15pm

 

Open with Tech Building Blocks
 Expo Hall Talk Steven Hwang Expo Hall
Wednesday, Oct 19
10:00am – 10:20am

 

Designing Datacenter Hardware for Environmental Sustainability
 Strategic Initiatives William Lin 210AE
01:00pm – 01:15pm

 

Channel loss challenge in complicated OAM system
 Server Bryan Wu 220C
01:15pm – 01:30pm

 

OAI Cooling Progress Update
 Server Jaylen Cheng 220C
Thursday, Oct 20
08:20am – 08:40am

 

Open System Firmware Status Update on OCP Crater Lake
 OSF Johnny Lin 210AE
09:40am - 10:00am

 

New Features of Multi-Node Server Management
 Hardware Management Bonnie Lo 210BF
10:30am - 10:50am

 

ORV3 48V system power architecture & HSC design consideration
 Rack & Power Andy Tai 220B
03:30pm - 03:45pm

 

Implementation of multi-partition Boot in CPUs with DC-SCM
 Hardware Management Clement Lee, Eric Huang 210BF

Whitepapers
1 min read

Design and Performance Measurement Guidelines for Enhanced Boiler Plate

Oct 17, 2022 

Nowadays, tremendous amounts of data processing, storage, and transmission are required for rising technologies and applications, such as cloud computing,...
1 min read

Architecture and Capabilities of Multi-Partition Boot

Oct 14, 2022 

Multi-Partition Boot is a method for a computer system having Booting Units and a large quantity of Central Processing Units (CPUs). Initially, the Booting...

Future-Ready Cooling Solutions and Easy Service Design for AI Training Systems

Oct 12, 2022 

Air cooling is the traditional way to remove heat generated from processing units by directing cool air through hot surfaces to dissipate heat.

In recent...

OAI System Liquid Cooling Guidelines

Oct 6, 2022 

This document is not a specification for OAI/OAM products. It is a set of guidelines on the design, validation, and implementation of liquid cooling solutions...