Building the Future of AI with Wiwynn and Wistron at OCP Global Summit 2025
Join Wiwynn and Wistron at OCP Global Summit 2025
Oct. 13-16, Booth B13, San Jose, CA
Join Wiwynn at the OCP Global Summit 2025 and explore how we are powering the next wave of AI innovation. From high-performance AI servers to cutting-edge cooling and power solutions, our technologies are designed to accelerate your AI journey and help you build the future.
Discover Our Solutions
AI Training & Inference Servers
Unleash next-level performance with Wiwynn’s purpose-built servers for AI training and inference. Wiwynn and Wistron are showcasing next-generation AI systems—empowering breakthroughs in machine learning and deep learning:
• NVIDIA GB300 NVL72: Rack-level, liquid-cooled AI system with 72 NVIDIA Blackwell Ultra GPUs and NVIDIA ConnectX-8 800Gb/s SuperNICs for unprecedented inference throughput and AI-factory scalability.
• NVIDIA HGX B300: 10U platform with eight NVIDIA Blackwell Ultra GPUs and up to 2.1TB HBM3e memory—built for the most demanding AI workloads.
• AMD Instinct™ MI350 Platform: Based on AMD CDNA™ 4 with EPYC™ CPUs and the AMD Pollara 400 AI NIC, delivering up to 35× inference performance improvement over the prior generation.
Advanced Cooling Technologies
Meet the demands of modern data centers with Wiwynn’s innovative cooling solutions:
• Double-sided Cold Plate: Proprietary microchannel + electrochemical 3D-printing design supporting up to 4 kW cooling capacity and up to 40% thermal performance gain.
• Two-phase Cold Plate: Uses dielectric, eco-friendly refrigerants with a patented 3D-printed wicking-fin structure to boost heat transfer and reduce leakage-related downtime for large-scale AI/HPC.
• 300 kW AALC Sidecar: Co-developed with Shinwa Controls to enable liquid-cooled AI racks in air-cooled data centers—enhancing capacity, reliability, and serviceability.
Power Solutions
Optimize your data center with Wiwynn’s next-generation Double-Wide Rack Architecture—a breakthrough design that unites HVDC power delivery, advanced liquid cooling, and signal-integrity-optimized layouts to address the growing demands of high-power AI computing. Doubling traditional rack width, it accommodates the latest accelerators such as AMD Instinct™ MI400 Series GPUs, supports 9.5-reticle chips with 12× HBM, and integrates liquid-cooled busbars for efficient, reliable, and scalable rack-level performance.
Why Wiwynn?
• Innovation: Pioneering next-gen AI servers and liquid-cooling architectures.
• Sustainability: Energy-efficient designs for greener data centers.
• Reliability: Trusted by hyperscale and enterprise customers worldwide.
Visit Us!
Don’t miss your chance to experience the future of AI firsthand. Stop by the Wiwynn booth B13 at OCP Global Summit 2025 to see live demos, meet our experts, and discover how our solutions can transform your AI infrastructure.
Ready to build the future together?
Contact us to learn more!
See the full schedule at OCP website
Learn more and register here.
Proved edge platform for versatile applications
Speeches
| Time | Type | Session | Speakers |
|---|---|---|---|
| Tuesday, Oct 14 | |||
| 3:15pm - 3:35pm | Cooling Environments & Liquid Cooling | Mega AALC for High Power Density AI Data Centers | Yuzhou Lin (Wiwynn), Rajesh Kasukurthy (AMD) |
| 3:45pm - 4:10pm | Executive Track | Building the Future of AI: Wiwynn Accelerates the Shift to AI-Driven Infrastructure | Alfred Chao (Wiwynn) |
| Wednesday, Oct 15 | |||
| 8:40am - 8:55am | Cooling Environments & Liquid Cooling | Impact of Die Warpage Changes on TIM Thermal Performance | Willie Chen (Wiwynn), Yin Hang (Meta) |
| 10:55am - 11:20am | FTS: Data Center Sustainability | Next-Generation Cold Plate with Electrochemical 3D-printed Microchannels | Jake Hsieh (Wiwynn) |
| 12:49pm - 1:04pm | Expo Hall Talk | Powering the AI Era: High-Density Racks, Cutting-Edge Systems, and Advanced Cooling from Wiwynn | Marcus Hsieh (Wiwynn) |
| 1:55pm - 2:15pm | Cooling Environments & Liquid Cooling | Cold Plate Design Considerations for E1.S Modules | Albert Li (Wiwynn), Dennis Trieu (Microsoft) |
| Thursday, Oct 16 | |||
| 8:15am - 8:25am | Sustainability | Low Carbon Emission Chassis Solution | Garrett Liu (Wiwynn) |
| 9:45am - 10:00am | Cooling Environments: Immersion | Long-Term Reliability Testing of Immersion Cooling | Neng Chieh Chang (Wiwynn) |
| 10:05am - 10:20am | Test & Validation | Beyond the Drive: Strategic Value of System-Level NVMe SSD Testing | Chandra Nelogal (Wiwynn), Nick Kriczky (Teledyne Lecroy) |
Edge & AI Solutions
ES100G2
The Advanced 1U Short-depth Platform for Edge AI Inference and vRAN/NFV
Read Datasheet
- 5th Gen Intel®Xeon® Processors with Integrated AI Acceleration
- Optimized vRAN/NFV Platform in Far Edge
- AI Inference for Versatile Edge Applications
- NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
- Carrier-Grade and NEBS Level 3 Compliant
ES200G2
The 2U Short-depth Platform for AI Inference/Training and All-in-one vRAN Applications
Read Datasheet
- 5th Gen Intel® Xeon® Processors and Add-on AI Acceleration
- AI Inference/Training and Diverse Applications
- All-in-one vRAN Platform in Far Edge
- NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
- Carrier-Grade and NEBS Level 3 Compliant
EP100G2
All-in-one 5G Platform for CU/DU/5GC/MEC and Private Networks
Read Datasheet
- 4th Gen Intel® Xeon® Scalable Processors
- Flexible 1U/2U Sled Designs for Versatile Applications
- Intel® QAT and AVX Enabled for Faster 5G/Edge Applications
- Short-Depth Form Factor for Diverse Edge Locations
- Pooled Power and Chassis Controller for Power Efficiency and Management
Vertical Use Cases with Partner Collaborations
Leveraging own proficiency in server design and manufacturing, Wiwynn actively working with eco-system partners to create synergies of combining expertise from hardware, software, and solution integration.
For different industry vertical applications, Wiwynn’s open RAN solution is designed to reduce infrastructure complexity and meet the field environmental constraints, and its short-depth form factor is perfect for diverse edge locations. With Wiwynn optimized solutions, you can realize 5G and create more possibilities, which people could never imagine before.
Edge & AI Solutions
ES100G2
The Advanced 1U Short-depth Platform for Edge AI Inference and vRAN/NFV
Read Datasheet
- 5th Gen Intel®Xeon® Processors with Integrated AI Acceleration
- Optimized vRAN/NFV Platform in Far Edge
- AI Inference for Versatile Edge Applications
- NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
- Carrier-Grade and NEBS Level 3 Compliant
ES200G2
The 2U Short-depth Platform for AI Inference/Training and All-in-one vRAN Applications
Read Datasheet
- 5th Gen Intel® Xeon® Processors and Add-on AI Acceleration
- AI Inference/Training and Diverse Applications
- All-in-one vRAN Platform in Far Edge
- NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
- Carrier-Grade and NEBS Level 3 Compliant
EP100G2
All-in-one 5G Platform for CU/DU/5GC/MEC and Private Networks
Read Datasheet
- 4th Gen Intel® Xeon® Scalable Processors
- Flexible 1U/2U Sled Designs for Versatile Applications
- Intel® QAT and AVX Enabled for Faster 5G/Edge Applications
- Short-Depth Form Factor for Diverse Edge Locations
- Pooled Power and Chassis Controller for Power Efficiency and Management
Vertical Use Cases with Partner Collaborations
Leveraging own proficiency in server design and manufacturing, Wiwynn actively working with eco-system partners to create synergies of combining expertise from hardware, software, and solution integration.
For different industry vertical applications, Wiwynn’s open RAN solution is designed to reduce infrastructure complexity and meet the field environmental constraints, and its short-depth form factor is perfect for diverse edge locations. With Wiwynn optimized solutions, you can realize 5G and create more possibilities, which people could never imagine before.