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Join Wiwynn at OCP Global Summit 2026

Oct 12-15, Booth C74, San Jose Convention Center

Today's AI factories face unprecedented challenges: increasing compute density, growing power constraints, exploding data traffic, and rising cooling requirements. Success is no longer determined by GPUs alone, but by how effectively the entire infrastructure stack works together.

Join Wiwynn at Booth C74, OCP 2026, to discover how innovations in compute, power, data interconnects, and cooling are helping customers build scalable, efficient, and sustainable AI factories for the future.

What to Expect:

Booth

AI Compute for Next‑Gen AI

Discover Wiwynn's next-generation AI platforms, featuring NVIDIA Vera Rubin NVL72 and the AMD Helios rack-scale solution. Designed for the AI Factory era, these systems address the challenges of compute density, power delivery, connectivity, and cooling to enable AI at scale.

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Optical Interconnect & CPO Innovations

Experience the live demonstration of our co-packaged optics (CPO) system with Ayar Labs and discover how next-generation rack-scale optical interconnects eliminate the bandwidth, power efficiency, and scalability bottlenecks of traditional copper in large-scale AI clusters.

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Advanced Cooling Technologies

Explore Wiwynn’s latest lineup of breakthrough thermal innovations engineered for high-density AI infrastructure. We are showcasing cutting-edge solutions, including 6kW-class double-sided liquid cooling with cavity PCB integration, double-sided cooling for VPD, 3D-printed microchannel cooling for Intel CPUs, lightweight plastic cold plate and manifold designs, diamond composite microchannel technologies, and two-phase cooling solutions. Through a series of live demonstrations, visitors can experience these cutting-edge technologies in action and see how they enable the next generation of AI infrastructure. Don't miss the opportunity to visit our booth and experience these innovations firsthand.

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Speeches

Time Type Session Speakers
Monday, Oct 12
12:25pm - 12:45pm Executive Track Building the AI Factory: Overcoming the Infrastructure Challenges of AI at Scale Tony Wen (Vice President, Wiwynn)
Tuesday, Oct 13
2:10pm - 2:25pm Expo Hall Talk Powering AI Infrastructure: Innovations in Compute, Power, Connectivity and Cooling Lentis Pai (Senior Director, Wiwynn)
Wednesday, Oct 14
10:20am - 10:35am FTS: Data Center Sustainability Investigation of Diamond-Based Materials for Direct Liquid Cooling of Next-Generation AI Chips Nick Liu (Wiwynn), Jake Hsieh (Wiwynn)
10:25am - 10:40am Cooling Environments Rack-Scale Weight Reduction and Reliability Validation for Liquid-Cooled Server Systems Using Lightweight Materials Jeff CA Chen (Wiwynn), Shawn Ma (Wiwynn)
10:50am - 11:10am Server Accelerating High-Power Server Design Through Board-Level Electro-Thermal Co-Simulation of VRMs and PDNs Steven Chien (Wiwynn), Zi Ping Wu (Microsoft)
1:10pm - 1:23pm FTI Workshop: Short Reach Optical Interconnects Rack-Ready High-Power ELSFPs: A Co-Development to Support CPO Deployment in AI Scale-Up and Scale-Out Datacenters Willie Chen (Wiwynn), Nandita Aggarwal (Ayar Labs)
3:15pm - 3:28pm FTI Workshop: Short Reach Optical Interconnects Open Rack-Scale Optical Infrastructure for AI Scale-Up with Co-Packaged Optics Kinny Chen (Wiwynn), Vishal Chandrasekar (Ayar Labs)
Thursday, Oct 15
1:05pm - 1:40pm Cooling: Cold Plate Reducing Operational Complexity Through Standardized Two-Phase Liquid Cooling for AI Infrastructure Jake Hsieh (Wiwynn), Shahar Belkin (ZutaCore)
2:10pm - 2:30pm Cooling: Cold Plate System-level Challenges and Considerations in Transitioning from Single-Phase to Two-Phase Cooling Jake Hsieh (Wiwynn), Yuzhou Lin (Wiwynn)

 

Join Us at OCP Summit 2026

Join us at the Wiwynn booth #C74 to see these technologies in action and discover how Wiwynn is powering the AI Factory through innovations in compute, power, connectivity, and cooling.

Booth

Proved edge platform for versatile applications

 

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Venue


Booth C74

San Jose Convention Center

Edge & AI Solutions

ES100G2_MWC

ES100G2


The Advanced 1U Short-depth Platform for Edge AI Inference and vRAN/NFV

    Read Datasheet
  • 5th Gen Intel®Xeon® Processors with Integrated AI Acceleration
  • Optimized vRAN/NFV Platform in Far Edge
  • AI Inference for Versatile Edge Applications
  • NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
  • Carrier-Grade and NEBS Level 3 Compliant
ES200G2_MWC

ES200G2


The 2U Short-depth Platform for AI Inference/Training and All-in-one vRAN Applications

    Read Datasheet
  • 5th Gen Intel® Xeon® Processors and Add-on AI Acceleration
  • AI Inference/Training and Diverse Applications
  • All-in-one vRAN Platform in Far Edge
  • NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
  • Carrier-Grade and NEBS Level 3 Compliant
EP100G2_MWC

EP100G2


All-in-one 5G Platform for CU/DU/5GC/MEC and Private Networks

    Read Datasheet
  • 4th Gen Intel® Xeon® Scalable Processors
  • Flexible 1U/2U Sled Designs for Versatile Applications
  • Intel® QAT and AVX Enabled for Faster 5G/Edge Applications
  • Short-Depth Form Factor for Diverse Edge Locations
  • Pooled Power and Chassis Controller for Power Efficiency and Management

Vertical Use Cases with Partner Collaborations

 

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Leveraging own proficiency in server design and manufacturing, Wiwynn actively working with eco-system partners to create synergies of combining expertise from hardware, software, and solution integration.

For different industry vertical applications, Wiwynn’s open RAN solution is designed to reduce infrastructure complexity and meet the field environmental constraints, and its short-depth form factor is perfect for diverse edge locations. With Wiwynn optimized solutions, you can realize 5G and create more possibilities, which people could never imagine before.

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