2026_OCP_web_font

與緯穎共赴 OCP 全球峰會 2026

2026 年 10 月 12–15 日，加州聖荷西會議中心，C74 攤位

當今 AI 工廠面臨前所未有的嚴峻挑戰：運算密度持續攀升、電力限制日趨嚴苛、資料傳輸量爆炸性成長，以及散熱門檻大幅提高。AI 的成功已不再單靠 GPU 本身，而是取決於整體基礎設施架構能否高效協同運作。

歡迎蒞臨 OCP 2026 緯穎 C74 攤位，深入探索我們在運算、電力、資料互連與先進冷卻技術上的極致創新，了解緯穎如何協助客戶打造具備高擴展性、極致效能與永續發展的未來 AI 工廠。

展出亮點

新世代 AI 運算平台

深入探索緯穎新世代 AI 平台，重點展示 NVIDIA Vera Rubin NVL72 與 AMD Helios 機櫃級解決方案 。專為 AI Factory 時代量身打造，全面克服運算密度、供電架構、高速互連與散熱的極限挑戰，全面賦能 AI 規模化部署。

Sec3

光學互連與 CPO 創新技術

現場見證與 Ayar Labs 合作開發的 co-packaged optics (CPO) 系統實機動態展示 ，深入探索 新世代機櫃級光學互連技術 如何打破傳統銅線在頻寬、能源效率與擴展性上的瓶頸，全面釋放大規模 AI clusters 的極致潛能。

Sec3

先進冷卻技術

深入探索緯穎專為高密度 AI 基礎設施打造的最新突破性散熱技術陣容。現場展示多項尖端解決方案，涵蓋 整合 cavity PCB 的 6kW 級雙面液冷、VPD 雙面散熱 、專為 Intel CPU 打造的 3D 列印微流道散熱、輕量化塑料冷板與分流歧管設計 、鑽石複合微流道技術 ，以及兩相液冷解決方案。透過一系列 實機動態展示，參觀者可親身見證尖端散熱技術的動態運作，了解其如何全面賦能新世代 AI 基礎設施。切勿錯過親臨攤位、第一線體驗技術創新的絕佳機會！

Sec3

演講議程

時間 類別 主題 講者
週一, 10 月 12 日
12:25pm - 12:45pm Executive Track Building the AI Factory: Overcoming the Infrastructure Challenges of AI at Scale Tony Wen (Vice President, Wiwynn)
週二, 10 月 13 日
2:10pm - 2:25pm Expo Hall Talk Powering AI Infrastructure: Innovations in Compute, Power, Connectivity and Cooling Lentis Pai (Senior Director, Wiwynn)
週三, 10 月 14 日
10:20am - 10:35am FTS: Data Center Sustainability Investigation of Diamond-Based Materials for Direct Liquid Cooling of Next-Generation AI Chips Nick Liu (Wiwynn), Jake Hsieh (Wiwynn)
10:25am - 10:40am Cooling Environments Rack-Scale Weight Reduction and Reliability Validation for Liquid-Cooled Server Systems Using Lightweight Materials Jeff CA Chen (Wiwynn), Shawn Ma (Wiwynn)
10:50am - 11:10am Server Accelerating High-Power Server Design Through Board-Level Electro-Thermal Co-Simulation of VRMs and PDNs Steven Chien (Wiwynn), Zi Ping Wu (Microsoft)
1:10pm - 1:23pm FTI Workshop: Short Reach Optical Interconnects Rack-Ready High-Power ELSFPs: A Co-Development to Support CPO Deployment in AI Scale-Up and Scale-Out Datacenters Willie Chen (Wiwynn), Nandita Aggarwal (Ayar Labs)
3:15pm - 3:28pm FTI Workshop: Short Reach Optical Interconnects Open Rack-Scale Optical Infrastructure for AI Scale-Up with Co-Packaged Optics Kinny Chen (Wiwynn), Vishal Chandrasekar (Ayar Labs)
週四, 10 月 15 日
1:05pm - 1:40pm Cooling: Cold Plate Reducing Operational Complexity Through Standardized Two-Phase Liquid Cooling for AI Infrastructure Jake Hsieh (Wiwynn), Shahar Belkin (ZutaCore)
2:10pm - 2:30pm Cooling: Cold Plate System-level Challenges and Considerations in Transitioning from Single-Phase to Two-Phase Cooling Jake Hsieh (Wiwynn), Yuzhou Lin (Wiwynn)

 

Join Us at OCP Summit 2026

Join us at the Wiwynn booth #C74 to see these technologies in action and discover how Wiwynn is powering the AI Factory through innovations in compute, power, connectivity, and cooling.

Booth

Proved edge platform for versatile applications

 

versatile_applications_MWC24

 

會場資訊


C74 攤位

聖荷西會議中心

Edge & AI Solutions

ES100G2_MWC

ES100G2


The Advanced 1U Short-depth Platform for Edge AI Inference and vRAN/NFV

    Read Datasheet
  • 5th Gen Intel®Xeon® Processors with Integrated AI Acceleration
  • Optimized vRAN/NFV Platform in Far Edge
  • AI Inference for Versatile Edge Applications
  • NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
  • Carrier-Grade and NEBS Level 3 Compliant
ES200G2_MWC

ES200G2


The 2U Short-depth Platform for AI Inference/Training and All-in-one vRAN Applications

    Read Datasheet
  • 5th Gen Intel® Xeon® Processors and Add-on AI Acceleration
  • AI Inference/Training and Diverse Applications
  • All-in-one vRAN Platform in Far Edge
  • NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
  • Carrier-Grade and NEBS Level 3 Compliant
EP100G2_MWC

EP100G2


All-in-one 5G Platform for CU/DU/5GC/MEC and Private Networks

    Read Datasheet
  • 4th Gen Intel® Xeon® Scalable Processors
  • Flexible 1U/2U Sled Designs for Versatile Applications
  • Intel® QAT and AVX Enabled for Faster 5G/Edge Applications
  • Short-Depth Form Factor for Diverse Edge Locations
  • Pooled Power and Chassis Controller for Power Efficiency and Management

Vertical Use Cases with Partner Collaborations

 

usecases-tiny

 

Leveraging own proficiency in server design and manufacturing, Wiwynn actively working with eco-system partners to create synergies of combining expertise from hardware, software, and solution integration.

For different industry vertical applications, Wiwynn’s open RAN solution is designed to reduce infrastructure complexity and meet the field environmental constraints, and its short-depth form factor is perfect for diverse edge locations. With Wiwynn optimized solutions, you can realize 5G and create more possibilities, which people could never imagine before.

bg-cases-original

Related Whitepapers