Building the Future of AI with Wiwynn and Wistron at OCP Global Summit 2025
緯穎與緯創共赴 2025 OCP 全球高峰會，邀您一同見證創新時刻
2025 年 10 月 13–16 日, 加州聖荷西, B13
與緯穎一同參與 OCP 全球高峰會 2025，探索我們如何引領下一波 AI 革新。緯穎攜手緯創展示新世代 AI 系統與先進液冷解決方案，展現加速運算與熱管理技術的極致創新，助力資料中心邁向更高效能與永續未來。
展出亮點
新世代 AI 系統
NVIDIA GB300 NVL72：緯穎與緯創為首批提供 NVIDIA GB300 NVL72 系統的合作夥伴之一。這款液冷、機櫃級 AI 系統搭載 72 顆 NVIDIA Blackwell Ultra GPU 與 NVIDIA ConnectX-8 800Gb/s SuperNICs，為推理模型推論提供前所未有的效能，引領新一波加速運算浪潮。
NVIDIA HGX B300：全新 10U 伺服器，配備 8 張 NVIDIA Blackwell Ultra GPU、1TB HBM3e 記憶體與 ConnectX-8 SuperNICs，為複雜 AI 工作負載提供突破性效能。
AMD Instinct™ MI350 系列 GPU 系統：搭載 AMD Instinct™ MI350 GPU、EPYC™ CPU 與 Pollara 400 AI NIC，推理效能較前代提升高達 35 倍，滿足新世代 AI 與 HPC 應用。
雙寬機櫃架構 (Double-Wide Rack Architecture)：支援高功耗 AI 晶片並整合 HVDC 供電與液冷系統，優化信號完整性與散熱效率。此架構為下一代加速器（如 AMD Instinct™ MI400 系列）提供強大的機櫃級效能。
先進冷卻技術
雙面液冷板 (Double-sided Cold Plate)：針對高功率 AI 加速器設計，結合微流道與電化學 3D 列印技術，提供高達 4 kW 散熱能力，效能提升可達 40%。
兩相液冷板 (Two-phase Cold Plate)：採用不導電環保冷媒與專利 3D 列印 wicking-fin 結構，透過相變散熱機制提升效率並降低停機風險，專為大規模 AI 與 HPC 而設。
300kW AALC Sidecar：與 Shinwa Controls 聯合開發的雙機櫃寬 AALC (Air-Assisted Liquid Cooling) 系統，提供高可靠度與易維護性，讓資料中心在不更動既有基礎設施的情況下導入液冷。
OCP Future Technologies Symposium：緯穎與 Fabric8Labs 發表「採用電化學 3D 列印微流道、支援超過 350 W/cm² 超高熱通量的新世代液冷板」技術，探討散熱與封裝共設計的最新突破。
尖端網路解決方案
NVIDIA Spectrum-X：基於 Spectrum-4 MAC 技術的乙太網路平台，整合 SONiC 與 NVIDIA Cumulus，為多租戶與超大規模 AI 雲端服務提供靈活且高效的網路連接。
Broadcom Tomahawk 6：102T 資料中心交換器，支援 64 埠、每埠 6 Tbps 傳輸速度，在 4RU 氣冷系統中實現極高密度與效能。
為什麼選擇緯穎？
• 創新：領先業界的 AI 訓練與推論系統設計，涵蓋伺服器、液冷與網路完整生態。
• 永續：以節能液冷與高效率電源設計實現綠色資料中心。
• 可靠：深受全球雲端與企業級客戶信任的合作夥伴。
歡迎蒞臨！
別錯過親身體驗 AI 未來的機會。請蒞臨 OCP 全球高峰會 2025 緯穎 B13 攤位（聖荷西會議中心），探索現場展示與技術演講，了解如何以創新液冷與 AI 系統架構，重塑資料中心的效能與永續性。
與我們聯繫
聯絡我們 以了解更多！
請參閱 OCP 官網完整議程
點此了解並註冊。
Proved edge platform for versatile applications
演講議程
| 時間 | 類別 | 主題 | 講者 |
|---|---|---|---|
| 週二, 10 月 14 日 | |||
| 3:15pm - 3:35pm | 冷卻環境與液冷技術 | Mega AALC：面向高功率密度 AI 資料中心的解決方案 | Yuzhou Lin (Wiwynn), Rajesh Kasukurthy (AMD) |
| 3:45pm - 4:10pm | 高階主管專題 | 打造 AI 未來：緯穎加速推動 AI 驅動的基礎設施轉型 | Alfred Chao (Wiwynn) |
| 週三, 10 月 15 日 | |||
| 8:40am - 8:55am | 冷卻環境與液冷技術 | 晶片翹曲變化對導熱介面材料熱性能的影響 | Willie Chen (Wiwynn), Yin Hang (Meta) |
| 10:55am - 11:20am | FTS：資料中心永續發展 | 新世代液冷板：電化學 3D 列印微流道技術 | Jake Hsieh (Wiwynn) |
| 12:49pm - 1:04pm | 展區演講 | 驅動 AI 時代：緯穎的高密度機櫃、尖端系統與先進散熱解決方案 | Marcus Hsieh (Wiwynn) |
| 1:55pm - 2:15pm | 冷卻環境與液冷技術 | E1.S 模組的液冷板設計考量 | Albert Li (Wiwynn), Dennis Trieu (Microsoft) |
| 週四, 10 月 16 日 | |||
| 8:15am - 8:25am | 永續發展 | 低碳排放機殼解決方案 | Garrett Liu (Wiwynn) |
| 9:45am - 10:00am | 冷卻環境：浸沒式 | 浸沒式液冷的長期可靠性測試 | Neng Chieh Chang (Wiwynn) |
| 10:05am - 10:20am | 測試與驗證 | Beyond the Drive：系統層級 NVMe SSD 測試的策略價值 | Chandra Nelogal (Wiwynn), Nick Kriczky (Teledyne Lecroy) |
Edge & AI Solutions
ES100G2
The Advanced 1U Short-depth Platform for Edge AI Inference and vRAN/NFV
Read Datasheet
- 5th Gen Intel®Xeon® Processors with Integrated AI Acceleration
- Optimized vRAN/NFV Platform in Far Edge
- AI Inference for Versatile Edge Applications
- NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
- Carrier-Grade and NEBS Level 3 Compliant
ES200G2
The 2U Short-depth Platform for AI Inference/Training and All-in-one vRAN Applications
Read Datasheet
- 5th Gen Intel® Xeon® Processors and Add-on AI Acceleration
- AI Inference/Training and Diverse Applications
- All-in-one vRAN Platform in Far Edge
- NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
- Carrier-Grade and NEBS Level 3 Compliant
EP100G2
All-in-one 5G Platform for CU/DU/5GC/MEC and Private Networks
Read Datasheet
- 4th Gen Intel® Xeon® Scalable Processors
- Flexible 1U/2U Sled Designs for Versatile Applications
- Intel® QAT and AVX Enabled for Faster 5G/Edge Applications
- Short-Depth Form Factor for Diverse Edge Locations
- Pooled Power and Chassis Controller for Power Efficiency and Management
Vertical Use Cases with Partner Collaborations
Leveraging own proficiency in server design and manufacturing, Wiwynn actively working with eco-system partners to create synergies of combining expertise from hardware, software, and solution integration.
For different industry vertical applications, Wiwynn’s open RAN solution is designed to reduce infrastructure complexity and meet the field environmental constraints, and its short-depth form factor is perfect for diverse edge locations. With Wiwynn optimized solutions, you can realize 5G and create more possibilities, which people could never imagine before.
Edge & AI Solutions
ES100G2
The Advanced 1U Short-depth Platform for Edge AI Inference and vRAN/NFV
Read Datasheet
- 5th Gen Intel®Xeon® Processors with Integrated AI Acceleration
- Optimized vRAN/NFV Platform in Far Edge
- AI Inference for Versatile Edge Applications
- NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
- Carrier-Grade and NEBS Level 3 Compliant
ES200G2
The 2U Short-depth Platform for AI Inference/Training and All-in-one vRAN Applications
Read Datasheet
- 5th Gen Intel® Xeon® Processors and Add-on AI Acceleration
- AI Inference/Training and Diverse Applications
- All-in-one vRAN Platform in Far Edge
- NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
- Carrier-Grade and NEBS Level 3 Compliant
EP100G2
All-in-one 5G Platform for CU/DU/5GC/MEC and Private Networks
Read Datasheet
- 4th Gen Intel® Xeon® Scalable Processors
- Flexible 1U/2U Sled Designs for Versatile Applications
- Intel® QAT and AVX Enabled for Faster 5G/Edge Applications
- Short-Depth Form Factor for Diverse Edge Locations
- Pooled Power and Chassis Controller for Power Efficiency and Management
Vertical Use Cases with Partner Collaborations
Leveraging own proficiency in server design and manufacturing, Wiwynn actively working with eco-system partners to create synergies of combining expertise from hardware, software, and solution integration.
For different industry vertical applications, Wiwynn’s open RAN solution is designed to reduce infrastructure complexity and meet the field environmental constraints, and its short-depth form factor is perfect for diverse edge locations. With Wiwynn optimized solutions, you can realize 5G and create more possibilities, which people could never imagine before.