This whitepaper explores the strategic advantages of 3D-Torus topology in meeting the escalating demands of large-scale AI and LLM workloads in...
This white paper presents a comprehensive analysis of a two-phase cold plate cooling solution specifically designed for high-power chips. The system...
This research presents an innovative approach to reducing server weight by replacing conventional thick chassis structures with thinner alternatives....
The white paper focuses on Wiwynn's implementation of Intel's Platform Firmware Resilience (PFR) in server systems, based on the NIST SP 800-193...
1 min read
As thermal design power (TDP) for modern processors such as CPUs, GPUs, and TPUs exceeds 1 kW, traditional air cooling methods are proving...
The integration of advanced liquid cooling systems in AI clusters is essential for maintaining thermal stability and optimizing performance. Key...
This whitepaper explores how Wiwynn utilizes innovative molded pulp packaging technology to provide environmentally friendly and protective packaging...
The bare die CPU, as an innovative product design, offers significant advantages over traditional designs across various stages, including product...
Impedance matching in trace design may lead to problems such as signal reflections, crosstalk, and dissipation, which can affect the overall system...
