SV302A

Powering the Most Impactful Cloud Computing
The AMD-Based High Density 1U2Node Server

3D Explore

Wiwynn SV302A

Features

Brilliant Combination of Compute Density and Power Efficiency

Wiwynn SV302A is a 1U2N computing server. One node supports one single AMD EPYC 7003 Series Processor CPU and delivers 64 cores. Therefore, when the 1U2N system is fully configured with each node carrying a 64 core CPU, the total core count is 128, making it the highest core density 1U x86 server. Moreover, comparing with dual socket design, the single socket design genuinely benefits on cooling and power efficiency to reduce TCO.

Universal Enclosure with Modularized Configurations for Various Workloads

Wiwynn incorporates highly modular design with universal enclosure to realize “building block” concept in SV302A. The modules include server node, power supply unit and fan modules, which provide high agility for logistic management to cloud service providers.
Wiwynn SV302A offers two configurations for different workloads – are compute intensive and I/O intensive. System operators may agilely configure different nodes with different combinations of processors, memory, NVMe SSDs, PCIe expansions in the same enclosure depending on different applications, such as real-time analytics, AI inference, and even mission critical tasks.

3RD GEN EPYC™ “MILAN” CPU

UNDISPUTED LEADERSHIP PERFORMANCE

Up To

25%

More mid-stack performance
where customers are buying

Up To

15%

Better pref/$ vs.
previous generation

Enhanced Performance and Inference for Computing Intensive Applications

Wiwynn SV302A is designed with AMD EPYC 7003 Series Processors to deliver exceptional performance with 64 cores, up to 32MB L3 cache/core using the new 7nm X86 hybrid die, 128 lanes of PCIe Gen4, and 16 DIMM slots. AMD 3rd gen EPYC processors help customers achieve faster and better time to results, providing up to 25% generational performance gains in mid-tier CPUs. With embedded high internal integer and foating-point capacity, SV302A enables enhanced computing acceleration in the cloud and on-prem.

Front Access Design to Simplify Maintenance

Easy manageability and serviceability are key OPEX factors of cloud service providers. Compared to traditional multi-node servers, the system is front-accessible with tool-less maintenance. Rack cabling and maintenance efforts are reduced to a minimum, enabling our customers to focus more on rack configuration and deployment scalability.

Tech Spec

Node Specifications
Model NameSV302A-CSV302A-I
Form Factor, Processor, Memory and Chipset
Form Factor1U, Half Width
ProcessorAMD EPYC™ 7003 Series Processors
Processor SocketsOne
SecurityTPM 2.0
Memory8 DIMM slots; DDR4 up to 3200MT/s; RDIMM
Storage and I/O
Front I/O‧ One Debug Port (USB 3.0 Type A CONN)
‧ One USB 3.0 Type A CONN
‧ One GbE RJ45 Port
‧ One OCP NIC Port
‧ Power/Reset button
Storage‧ Four 2.5″ U.2 NVMe SSD
‧ Three onboard 2280/21100 M.2 SSD Module slots
‧ Two2.5″ U.2 NVMe SSD
‧ Three onboard 2280/21100 M.2 SSD Module slots
Expansion Slots‧ One PCIe 4.0 x16 OCP NIC 3.0‧ One PCIe 4.0 x16 FHHL slot
‧ One PCIe 4.0 x16 OCP NIC 3.0
Remote ManagementIPMI v2.0 Compliant
Physical Specications
Dimensions (mm)224 (W) x 790 (D) x 43.5 (H)
Weight(mm)19.5kg
Chassis Specication
PSU2 x 800W/1300W (1+1), hot-swappable
Fan6 dual-rotor hot-plug fans for 2 zones
Dimensions (mm)448 (W) * 790 (D) * 43.5 (H)

Download

CategoryFile TitleRelease DateActions
DatasheetSV302A Datasheet2021/03/02 Download