Whitepapers

Get access to in-depth Whitepapers on building data center solutions, cooling, and AI accelerating in the cloud

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White Paper: Platform Optimization for Performance and Endurance with QLC and Cloud Storage Acceleration Layer

High-density QLC SSDs break the 4 KiB assumptions baked into today’s storage stacks: their larger indirection units inflate write-amplification,...

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White Paper: Best Practices and Integration Strategies for XPU and 224Gbps in 3D Torus Rack-Level Topology

AI and large-language-model clusters are straining the limits of traditional fat-tree and star networks. When tens of billions of parameters move...

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White Paper: Innovative Two-Phase Cold Plate Solutions for Future High-Power AI Chips

AI accelerators and next-gen HPC processors are already nudging past the one-kilowatt mark, making single-phase liquid loops struggle with soaring...

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White Paper: The Lightweight Patterned Reinforced Chassis In Server Product

Demand for more servers is climbing fast and every extra kilogram of steel increases cost, shipping emissions, and rack loading. Our latest white...

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White Paper: Platform Root of Trust Application on Intel Server

The white paper focuses on Wiwynn's implementation of Intel's Platform Firmware Resilience (PFR) in server systems, based on the NIST SP 800-193...

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White Paper: Study of Jet Impinging and Integrated Cold Plate for Unleashing Chipset Power

As thermal design power (TDP) for modern processors such as CPUs, GPUs, and TPUs exceeds 1 kW, traditional air cooling methods are proving...

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White Paper: A Holistic Approach to Managing Liquid-Cooled AI Clusters

The integration of advanced liquid cooling systems in AI clusters is essential for maintaining thermal stability and optimizing performance. Key...

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White Paper: Innovation Molded Pulp Packaging for Server Products

This whitepaper explores how Wiwynn utilizes innovative molded pulp packaging technology to provide environmentally friendly and protective packaging...

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White Paper: Anti-tilt Mechanism for Bare Die CPU

The bare die CPU, as an innovative product design, offers significant advantages over traditional designs across various stages, including product...

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