Join Wiwynn at COMPUTEX 2026
Create AI Beyond Limits.
June 2–5, TaiNEX 1, 1F #J0106
As AI applications demand faster response, higher throughput, and greater autonomy, data centers are reaching new limits in power delivery, power density, and interconnect bandwidth. Overcoming these challenges requires a holistic, system-level approach to data center integration.
At COMPUTEX 2026, Wiwynn presents the comprehensive AI factory stack, spanning high-power architectures, optical interconnect technologies, and advanced cooling solutions purpose-built for the next generation of AI factories.
What to Expect:
AI Compute & Storage for Next‑Gen AI
High‑performance AI platforms NVIDIA Vera Rubin NVL72, AMD "Helios" rack-scale solution, designed to support large‑scale AI training and inference, along with a storage server prototype that enable GPU‑direct storage access for data‑intensive AI inference and retrieval workloads.

Optical Interconnect & CPO Innovations
CPO‑oriented system designs that highlight the transition beyond copper toward optical interconnect at rack scale.

High‑Voltage Power Architecture (HVDC)
Our 800VDC power rack and PDB design that reflects the industry’s shift toward higher‑voltage power architectures for next‑generation AI datacenters.

Advanced Cooling Technologies
Advanced liquid cooling designs centered on a 6kW‑class double‑sided liquid cooling solution with cavity PCB integration, together with Diamond Composite–based microchannel designs for high‑power AI systems.

Join Us at COMPUTEX 2026
From AI clusters to AI factories, Wiwynn is the partner for next‑generation AI infrastructure. Visit Booth #J0106 to discover how Wiwynn goes beyond today’s limits with high‑power, optically connected, system‑level designs.
Beyond COMPUTEX, Wiwynn will also be at GTC Taipei 2026, showcasing NVIDIA Vera Rubin NVL72 and the First‑Place GTC 2026 award‑winning poster, “Autonomous AI Agent for End‑to‑End Component Data Extraction.” Visit us at TICC to see the exhibit.

Proved edge platform for versatile applications

Venue
TaiNEX 1, 1F, Entrance J
Booth #J0106
Edge & AI Solutions
ES100G2
The Advanced 1U Short-depth Platform for Edge AI Inference and vRAN/NFV
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- 5th Gen Intel®Xeon® Processors with Integrated AI Acceleration
- Optimized vRAN/NFV Platform in Far Edge
- AI Inference for Versatile Edge Applications
- NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
- Carrier-Grade and NEBS Level 3 Compliant
ES200G2
The 2U Short-depth Platform for AI Inference/Training and All-in-one vRAN Applications
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- 5th Gen Intel® Xeon® Processors and Add-on AI Acceleration
- AI Inference/Training and Diverse Applications
- All-in-one vRAN Platform in Far Edge
- NGC-Ready, NVQual-Certified, Wind River Criteria for Enhanced Performance
- Carrier-Grade and NEBS Level 3 Compliant
EP100G2
All-in-one 5G Platform for CU/DU/5GC/MEC and Private Networks
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- 4th Gen Intel® Xeon® Scalable Processors
- Flexible 1U/2U Sled Designs for Versatile Applications
- Intel® QAT and AVX Enabled for Faster 5G/Edge Applications
- Short-Depth Form Factor for Diverse Edge Locations
- Pooled Power and Chassis Controller for Power Efficiency and Management
Vertical Use Cases with Partner Collaborations

Leveraging own proficiency in server design and manufacturing, Wiwynn actively working with eco-system partners to create synergies of combining expertise from hardware, software, and solution integration.
For different industry vertical applications, Wiwynn’s open RAN solution is designed to reduce infrastructure complexity and meet the field environmental constraints, and its short-depth form factor is perfect for diverse edge locations. With Wiwynn optimized solutions, you can realize 5G and create more possibilities, which people could never imagine before.