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White Paper: Advancing Vertical Power Delivery
As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
The OCP ACS (Advanced Cooling Solution) is a sub-project under the OCP Rack & Power Project. The Immersion sub-project enables community driven activities focused on facilitating OCP and industry progression of immersion cooling. Within the Rack and Power ACS group, this project also facilitates harmonization between different ACS sub-projects and the Advanced Cooling Facilities sub-project to the DCF group
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As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
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This study proposes a heat-flux-based non-uniform straight-microchannel cold plate design for non-uniform chip heat loading. A preliminary parametric...
The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power...