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White Paper: Anti-tilt Mechanism for Bare Die CPU
The bare die CPU, as an innovative product design, offers significant advantages over traditional designs across various stages, including product...
White Paper: How to Optimize PCB finished in-board Trace Width to meet Impedance Requirement
Impedance matching in trace design may lead to problems such as signal reflections, crosstalk, and dissipation, which can affect the overall system...
White Paper: The Finite Element Analysis Methodology for Printed Circuit Board Assembly
Traditional approaches, such as Trace Mapping FEA, often encounter significant challenges due to uncertainties in material properties and high...