Wiwynn
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White Paper: Advancing Vertical Power Delivery
As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
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White Paper: Breaking the Thermal–Hydraulic Trade-Off: A Non-Uniform Straight-Microchannel Cold Plate for High-Heat-Flux Cooling
This study proposes a heat-flux-based non-uniform straight-microchannel cold plate design for non-uniform chip heat loading. A preliminary parametric...
White Paper: System Integration and Deployment Considerations for CPO-Based AI Scale-Up Infrastructure
The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power...