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Recap of Wiwynn at OCP Global Summit 2026: Scaling AI Beyond Limits

Picture of Wiwynn Wiwynn October 20, 2026

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At the OCP Global Summit 2026, Wiwynn presented advances in compute, power, interconnect, and cooling technologies designed to build scalable, efficient, and sustainable AI factories. Through these exhibits, Wiwynn underscored its deep expertise in frontier technologies and its vision for the future of AI data centers.

For next-generation AI infrastructure, Wiwynn introduced NVIDIA Vera Rubin NVL72 and the AMD Helios rack-scale solution. Built for the AI factory era, these platforms tackle challenges in compute density, power delivery, connectivity, and cooling. Through close collaboration with its partners, Wiwynn leverages its rack integration and manufacturing expertise to provide adaptable solutions tailored to CSP requirements.

Together with Ayar Labs and GUC, Wiwynn presented a rack-level architecture integrating GUC's multi-chip packages (MCPs) with Ayar Labs' TeraPHY™ optical engines (OEs). Real-time telemetry confirmed an active optical link, while stable signal-quality metrics under thermal and wavelength drift validated the system's readiness for real-world operation.

Wiwynn also unveiled a comprehensive portfolio of forward-looking cooling innovations, including Diamond-Based Microchannel Cooling, 6 kW Double-Sided Cold Plate with Cavity PCBA and VPD, and Lightweight Cold Plate and Inner Manifold Design. These developments reinforce Wiwynn's commitment to pushing beyond the physical limits of conventional thermal architectures.

At this year's summit, Wiwynn reached a new milestone with nine executive and technical breakout sessions, showcasing the knowledge of our team and the invaluable support of our industry partners. Together, we continue to exchange insights, contribute to the Open Compute Project community, and drive progress in AI infrastructure.