Recap of Wiwynn at COMPUTEX 2026: Scaling the AI Future

At COMPUTEX 2026, Wiwynn showcased the evolution of next-generation AI infrastructure across compute, storage, interconnect, and cooling. The exhibition brought together practical, rack-scale innovations designed to support the growing performance and density demands of future AI data centers.

Wiwynn showcased NVIDIA and AMD rack-scale platforms, including the NVIDIA Vera Rubin NVL72 and AMD Helios rack-scale solution, demonstrating its system integration capabilities for next-generation AI infrastructure.

In optical interconnect, Wiwynn collaborated with Ayar Labs, GUC, and fiber ecosystem partners—including Browave, Corning, FOCI, Molex, SENKO, and TE Connectivity—to demonstrate a CPO-based optical scale-up rack design. The showcase highlighted how optical connectivity can help overcome the limitations of traditional copper interconnects and support the next stage of AI scale-up.

Complementing these innovations, Wiwynn introduced a range of advanced thermal designs, including the 6kW Double-sided Cold Plate with Liquid Metal TIM, Space Cooling concepts, and Diamond Composite Cooling technologies, reflecting our continued focus on solving system-level thermal challenges for high-density AI deployments.

Wiwynn’s COMPUTEX 2026 showcase underscored our vision for the next generation of AI infrastructure—where compute, storage, interconnect, and cooling are designed together at rack scale. Through continued innovation and ecosystem collaboration, Wiwynn is advancing the system-level foundation for future AI data centers.

Inspiring Moments of Wiwynn at COMPUTEX 2026

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