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White Paper: Advancing Vertical Power Delivery
As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
In November 2020, Wiwynn partnered with Radisys to participate in the Second Global O-RAN Alliance Plugfest for multi-vendor interoperability test. The solution includes a disaggregated 5G sub-6 GHz O-RAN O-DU and an O-CU and adopts Intel® FlexRAN fronthaul transportation reference architecture.
In this whitepaper, we will take a closer look at the O-RAN Alliance architecture as well as an overview of the Wiwynn 5G SA sub-6 GHz O-DU and O-CU solutions. You can see how the flexibility of EP100 helps service providers to deploy different scenarios and enjoy serviceability and manageability with single hardware architecture.
Leave your contact information to download the whitepaper!
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As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
1 min read
This study proposes a heat-flux-based non-uniform straight-microchannel cold plate design for non-uniform chip heat loading. A preliminary parametric...
The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power...