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White Paper: Advancing Vertical Power Delivery
As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
Wiwynn
Updated on April 27, 2026
This whitepaper outlines guidance for liquid cooling integration and logistics when deploying liquid cooled Information Technology Equipment (ITE) and Racks in a data center facility. A comprehensive overview of ITE manufacturing stages is covered in detail including cold plate and manifold integration with a focus on quality assurance activities.
The whitepaper is focused on liquid cooling integration specifically within the Technology Cooling System (TCS), which includes cooling components such as cold plates, rack manifolds, Coolant Distribution Unit (CDU, end of row, or in rack CDUs), heat exchangers, hoses, and couplings.
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As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
1 min read
This study proposes a heat-flux-based non-uniform straight-microchannel cold plate design for non-uniform chip heat loading. A preliminary parametric...
The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power...