White Paper: Anti-tilt Mechanism for Bare Die CPU
The bare die CPU, as an innovative product design, offers significant advantages over traditional designs across various stages, including product...
This whitepaper outlines guidance for liquid cooling integration and logistics when deploying liquid cooled Information Technology Equipment (ITE) and Racks in a data center facility. A comprehensive overview of ITE manufacturing stages is covered in detail including cold plate and manifold integration with a focus on quality assurance activities.
The whitepaper is focused on liquid cooling integration specifically within the Technology Cooling System (TCS), which includes cooling components such as cold plates, rack manifolds, Coolant Distribution Unit (CDU, end of row, or in rack CDUs), heat exchangers, hoses, and couplings.
Download Now
The bare die CPU, as an innovative product design, offers significant advantages over traditional designs across various stages, including product...
Impedance matching in trace design may lead to problems such as signal reflections, crosstalk, and dissipation, which can affect the overall system...
Traditional approaches, such as Trace Mapping FEA, often encounter significant challenges due to uncertainties in material properties and high...