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White Paper: Advancing Vertical Power Delivery
As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
This document is not a specification for OAI/OAM products. It is a set of guidelines on the design, validation, and implementation of liquid cooling solutions for AI Training Systems with 8x OAM products or others alike.
Contents of the document would help a user/designer/supplier of OAI/OAM products understand the basics around those topics/questions related to liquid cooling.
For most engineering topics/questions discussed in this document, we (the OAI Cooling workstream members) are contributing what we believed to be best practices as of today. However, for each product, there would be more than one way to design/validate/use it, not to mention potential technology evolvement or changes of dependencies down the road. Please keep open-minded while reading this document, and do not hesitate to contact us directly for feedback and further discussion.
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As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
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This study proposes a heat-flux-based non-uniform straight-microchannel cold plate design for non-uniform chip heat loading. A preliminary parametric...
The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power...