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White Paper: Advancing Vertical Power Delivery
As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
Cooling for data center is becoming more and more challenging as the power of processing units increases significantly. Liquid cooling would be one of the solutions to meet this upcoming high-power demand for its ability to maintain high cooling efficiency.
In this whitepaper, Wiwynn takes a normal 1U, 2-socket spread core motherboard server as the model for the discussion of L10 internal thermal solution. We propose two coolant loop designs, parallel and series, and analyze thermal performance and serviceability of the liquid cooling solution.
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As modern compute silicon continues to scale in power density—driven by AI training clusters, high-performance computing (HPC) accelerators, and...
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This study proposes a heat-flux-based non-uniform straight-microchannel cold plate design for non-uniform chip heat loading. A preliminary parametric...
The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power...