Performance optimized 2U 3Node OCP server for computing-intensive applications
Performance and Scalability Enhancement
Wiwynn SV7220G3 Series features Intel® Xeon® Scalable Processors and the 2nd Generation Intel® Xeon® Scalable Processors. The latter provide pervasive performance enhancement including higher per-core performance and CPU frequency.
Up to 50% Increased Performance
While delivering total energy savings as high as 25% compared to DDR3 with DDR4.
Enhanced Memory Performance
Compared with prior-gen processors, 2nd Generation Intel® Xeon® Scalable Processors increase memory speed and capacity, supporting up to 2933MHz memory speed and 16Gb-based DDR4 DIMMs. Wiwynn SV7220G3 Series is designed with 12 DIMM slots, with 16Gb-based DDR4 DIMMs support, SV7220G3 gets double system memory capacity up to 3TB.
Painless Upgrade for AI Inference
The new feature of Intel® Deep Learning Boost (VNNI) empowers Wiwynn SV7220G3 to deliver significant and more efficient AI inference acceleration without hardware changes. With support of Intel® Optane™ DC persistent memory (AEP), data centers can utilize up to 512GB per DIMM for in-memory database, in-memory analytics or super-fast storage applications with affordable cost.
Various SKUs for Computing-intensive Applications
The high density 2U3Node architecture is approved by OCP having the optimized power efficiency is widely deployed in hyper-scale datacenters for computing-intensive applications. Wiwynn SV7220G3-S, the latest product based on this architecture, is your best choice. Another advanced model, SV7220G3-V with four 2.5” drive trays offers enhanced I/O performance.
Hot-plug Server and Front-access I/O for Easy Installation and Maintenance
Compared to traditional GPU servers, the system is front-accessible with tool-less maintenance. Rack cabling and maintenance efforts are reduced to a minimum, enabling our customers to focus more on rack configuration and deployment scalability. The server board leverages OCP Project Olympus server board which had been massively used and verified in hyper-scale data centers, that guarantees availability.
|Form Factor, Processor, Memory and Chipset|
|Processor||Intel® Xeon® Scalable Processors / Next Generation Intel® Xeon® Scalable Processors|
|Chipsets||Intel® C621 series ‧ TPM 2.0|
|System Bus||Intel® UltraPath Interconnect; 10.4GT/s|
|Memory||Up to 3TB; DDR4 up to 2933MT/s; 12 DIMM slots|
|Storage and I/O|
|Storage||One 3.5″ hot-plug drive bay per node: ‧ SAS/ SATA HDD M.2 SSD Module ‧ 1 (Option on carrier card)|
|Expansion Slots||Two (PCIe x16) FHHL slots, One OCP Mezzanine card (PCI-e x16) for: ‧ Single/Dual 10GbE DA/SFP+ ports (option) ‧ Single/Dual 25GbE SFP28 ports (option) ‧ Single/Dual 100GbE QSFP ports (option)|
|BMC Chipset||ASPEED AST2500 with VGA|
|Management LAN||One GbE Dedicated BMC Port|
|LAN||Multi-host 100GbE OCP 3.0 NIC card (shared by 4 nodes)|
|Remote Management||OpenBMC, IPMI partial support iKVM, Wiwynn Cluster Manager (option)|
|Power Consumption||108W (Idle); 330W (Max)|
|Power Supply||Centralized OCP Power Shelf|
|Dimensions (mm)||2OU (Open Rack); 174 (W) x 880 (D) x 89 (H) (mm)|
|Weight||6.9 kg ~ 7.3 kg (per node)|
|PSU||Centralized 12.5V DC bus bar|
|OS Support List||RedHat Enterprise Linux 7.4 Ubuntu 18.0|