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Performance optimized 2U 3Node OCP server for computing-intensive applications





Performance and Scalability Enhancement

Wiwynn SV7220G3 Series features Intel® Xeon® Scalable Processors and the 2nd Generation Intel® Xeon® Scalable Processors. The latter provide pervasive performance enhancement including higher per-core performance and CPU frequency.

Up to 50% Increased Performance

While delivering total energy savings as high as 25% compared to DDR3 with DDR4.

Enhanced Memory Performance

Compared with prior-gen processors, 2nd Generation Intel® Xeon® Scalable Processors increase memory speed and capacity, supporting up to 2933MHz memory speed and 16Gb-based DDR4 DIMMs. Wiwynn SV7220G3 Series is designed with 12 DIMM slots, with 16Gb-based DDR4 DIMMs support, SV7220G3 gets double system memory capacity up to 3TB.

Painless Upgrade for AI Inference

The new feature of Intel® Deep Learning Boost (VNNI) empowers Wiwynn SV7220G3 to deliver significant and more efficient AI inference acceleration without hardware changes. With support of Intel® Optane™ DC persistent memory (AEP), data centers can utilize up to 512GB per DIMM for in-memory database, in-memory analytics or super-fast storage applications with affordable cost.


Various SKUs for Computing-intensive Applications

The high density 2U3Node architecture is approved by OCP having the optimized power efficiency is widely deployed in hyper-scale datacenters for computing-intensive applications. Wiwynn SV7220G3-S, the latest product based on this architecture, is your best choice. Another advanced model, SV7220G3-V with four 2.5” drive trays offers enhanced I/O performance.


Hot-plug Server and Front-access I/O for Easy Installation and Maintenance

Compared to traditional GPU servers, the system is front-accessible with tool-less maintenance. Rack cabling and maintenance efforts are reduced to a minimum, enabling our customers to focus more on rack configuration and deployment scalability. The server board leverages OCP Project Olympus server board which had been massively used and verified in hyper-scale data centers, that guarantees availability.


Tech Spec

Form Factor, Processor, Memory and Chipset
Processor Intel® Xeon® Scalable Processors / Next Generation Intel® Xeon® Scalable Processors
Chipsets Intel® C621 series ‧ TPM 2.0
System Bus Intel® UltraPath Interconnect; 10.4GT/s
Memory Up to 3TB; DDR4 up to 2933MT/s; 12 DIMM slots
Storage and I/O
Storage One 3.5″ hot-plug drive bay per node: ‧ SAS/ SATA HDD M.2 SSD Module ‧ 1 (Option on carrier card)
Expansion Slots Two (PCIe x16) FHHL slots, One OCP Mezzanine card (PCI-e x16) for: ‧ Single/Dual 10GbE DA/SFP+ ports (option) ‧ Single/Dual 25GbE SFP28 ports (option) ‧ Single/Dual 100GbE QSFP ports (option)
BMC Chipset ASPEED AST2500 with VGA
Management LAN One GbE Dedicated BMC Port
LAN Multi-host 100GbE OCP 3.0 NIC card (shared by 4 nodes)
Remote Management OpenBMC, IPMI partial support iKVM, Wiwynn Cluster Manager (option)
Power Consumption 108W (Idle); 330W (Max)
Power Supply Centralized OCP Power Shelf
Dimensions (mm) 2OU (Open Rack); 174 (W) x 880 (D) x 89 (H) (mm)
Weight 6.9 kg ~ 7.3 kg (per node)
PSU Centralized 12.5V DC bus bar
OS Support List RedHat Enterprise Linux 7.4 Ubuntu 18.0


Category File Title Release Date Actions
Datasheet SV7200G3 Datasheet 2020/04/30 Download