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High density 1U2Node server with versatile system configurations for compute intensive workloads





Optimized System Architecture for Compute Intensive Workloads

Wiwynn SV302G3 system is a 1U server platform that is capable of configuring with one or dual nodes with dual socket CPU within each node. It features Intel® Xeon® Scalable Processors and the 2nd Generation Intel® Xeon® Scalable Processors. The latter provides pervasive performance enhancement including higher per- core performance and CPU frequency

Enhanced Memory and Optimized Thermal Solution

For memory capacity, it is designed with 16 DIMM slots per node; DDR4 up to 2933MT/s and 64Gb -based DDR4 DIMMs, system memory capacity up to 1TB. As a high density 1U2Node chassis, SV302G3 offers an optimized thermal solution for balancing cooling and power efficiency.


Painless Upgrade for Machine Learning

The new feature of Intel® Deep Learning Boost (VNNI) empowers Wiwynn SV302G3 to deliver significant and more efficient AI inference acceleration without hardware changes. With support of Intel® Optane™ DC persistent memory (AEP), data centers can utilize up to 512GB per DIMM for in-memory database, in-memory analytics or super-fast storage applications with affordable cost.



Versatile System Configurations with Universal Enclosure

Wiwynn SV302G3 offers three configurations for different workloads, which are compute intensive, I/O intensive and compute-storage balanced. System operators may agilely configure different nodes of the combination of processors, NVMe SSDs, PCIe expansions in the same enclosure depending on different applications, such as real-time analytics, AI inference, and even mission-critical tasks.


Front Access Design to Simplify Maintenance

Easy manageability and serviceability is key factor for OPEX of cloud service providers. Compared to traditional multi-node servers, the system is front-accessible with tool-less maintenance. Rack cabling and maintenance efforts are reduced to a minimum, enabling our customers to focus more on rack configuration and deployment scalability.

Tech Spec

Node Specification
Form Factor 1U, Half Width/1U, Full Width
Processor Next Generation Intel® Xeon® Scalable Processors
Memory 16 DIMM slots; DDR4 up to 2933 MT/s
Chipset Intel® C621 series
Security TPM 2.0
System Bus Intel® UltraPath Interconnect; 10.4GT/s
Processor Sockets 2
Storage SV302G3-C:
‧Four 2.5" U.2 NVMe SSD
‧One onboard 2280/21100
M.2 SSD Module slot
‧Two 2.5" U.2 NVMe SSD
‧One onboard 2280/21100
M.2 SSD Module slot
‧Eight 2.5" U.2 NVMe SSD
‧One onboard 2280/21100
M.2 SSD Module slot
Expansion Slots SV302G3-C:
‧One OCP NIC 2.0 card
(PCIe 3.0 x16)
‧One PCIe x16 FHHL slot
‧One OCP NIC 2.0 card
(PCIe 3.0 x16)
‧One PCIe x16 FHHL slot
‧One OCP NIC 2.0 card
(PCIe 3.0 x16)
Management LAN IPMI v2.0 Compliant, iKVM, Wiwynn Cluster Manager
I/O Ports ‧One Debug Port (USB 3.0 Type A CONN)
‧One USB 3.0 Type A CONN
‧One GbE RJ45 Port
‧One OCP NIC Port
‧Power/Reset button
Chassis Specification
Dimensions 448 (W) * 790 (D) * 43.5 (H)
PSU 2 x 800W/1300W (1+1), hot-swappable
Fan 6 dual-rotor hot-plug fans for 2 zones
Weight 19.5kg/39kg


Category File Title Release Date Actions
Datasheet SV302G3 2021/12/17 Download