The Tailored-made MEC Server with Flexible Configurations for Various Edge Applications
Short Chassis for Edge Deployment
The ES200 is designed to be a stand-alone 2U MEC server with short depth of 450mm, which supports EIA-19” rack mount and especially for Telco 19” short rack. It is purposed to be a drop-in replacement under Telco environment that are not be modern as many recently built centralized data centers that comes with standard facilities.
New Intel Xeon Scalable Processors with Built-in Acceleration
ES200 is one of Edge Computing platform series, which supports two Intel 3rd Gen Intel® Xeon® Scalable Processors (codename Ice Lake), with 80 cores, that provides 40% performance improvement. With built-in Intel Deep Learning Boost, ES200 is ideal for complex AI workloads. ES200 also supports Intel Software Guard Extension (SGX), which helps secure data and application code, and Intel Speed Select, which helps optimize specific workload such as NFVI.
NEBS-3 Compliant for Harsh Conditions
ES200 is compliant to NEBS-3, which is a clear index that the hardware can endure varying and tough physical conditions. NEBS-3 comprises a number of guidelines for designing equipment that can be deployed where the operating conditions often are challenging. By compliant to NEBS-3, it is proved that ES200 is solid as a rock for edge environment.
Flexible Configuration for Various Edge Computing including AI Workloads
ES200 supports PCIe Gen4 which enables faster I/O speed for various edge applications. With flexible configurations of up to 6 PCIe Gen4 cards & two OCP NIC 3.0 cards, it is best suited for various AI workloads. With various storage modular design of different SKUs such as EDSFF, U.2 SSD the flexibility of system storage is ideal for different applications.
Hot-Swappable PSU & FAN and Front I/O for Easy Services
ES200 comes with all front-end PCIe & storage I/O design which could expedite the services time at edge sites with limited space condition. At the rear, the system is equipped with 3+1 fan and 1+1 power redundancy to withstand single point of failure.
|Processor||3rd Generation Intel® Xeon® Scalable Processors, TDP 250W/270W|
|Chipset||Intel® C621A series|
|Security||TPM v2.0 (option)|
|System Bus||Intel® UltraPath Interconnect; 11.2GT/s|
|Memory||16 DIMM slots; DDR4 up to 3200 MT/s, and up to 64GB per DIMM;|
12 DIMM slots with up to 2 DCPMMs (Intel Barlow Pass)
|Storage||‧ One onboard 2280/22110 M.2 SSD Module slot|
‧ Six U.2 (15/7mm), or Eight EDSFF E1.S (5.9/9.5mm)
|Expansion Slots||Up to six PCIe Gen4 slots:|
‧ Two PCIe x16 FHFL Dual-width + One PCIe x8 FHHL
‧ One PCIe x16 FHHL slots + Two PCIe x8 FHHL
‧ Six PCIe x8 FHHL slots is optional by demand
Two on-board OCP 3.0 NIC x16
|Management LAN||‧ One GbE Dedicated BMC Port|
|I/O Ports||‧ Power Button w/ LED|
‧ UID Button w/ LED
‧ RST Button
‧ Three USB ports
‧ BMC Management port (front side)
‧ VGA port (D-sub)
|Dimensions||2U Rack; 86(H) x 440 (W) x 450 (D) (mm)|
|PSU||Hot-pluggable, Redundant (1+1) 1600W CRPS|
|Fan||Four 8038 dual rotor, Redundant (7+1)|
|‧ Ambient operating temperature range: 5 to 40 degree Celsius|
‧ Operating and Storage relative humidity: 10% to 90% (non-condensing)
‧ Storage temperature range: -40 to +70 degree Celsius