Wiwynn Showcases Next-Gen AI Platforms, Thermal Engineering, and Optical Interconnect Technologies at 2026 OCP Global Summit

Written by Wiwynn | Oct 12, 2026, 7:00:00 PM

San Jose, CA — October 12, 2026 — Wiwynn Corporation, a leading cloud IT infrastructure provider, today unveiled its latest AI infrastructure innovations at the 2026 OCP Global Summit (Booth C74, San Jose Convention Center), spanning next-generation AI rack platforms, breakthrough thermal technologies, and co-packaged optics (CPO) solutions. This reflects its holistic approach across compute, cooling, power, and connectivity.

"As AI workloads push compute density to unprecedented levels, the industry needs partners who can deliver proven, full-stack engineering across the entire rack," said William Lin, President and CEO of Wiwynn. " At OCP 2026, we are showcasing our end-to-end capability from custom design to high-volume rack integration, combined with continued investment in advanced cooling, power and optical interconnect technologies, Wiwynn is committed to build the next generation of AI infrastructure at scale with CSP customers and ecosystem partners."

Next-generation AI Rack Platforms

NVIDIA Vera Rubin NVL72: Wiwynn and Wistron are among the first NVIDIA Pilot Build Partners for the NVIDIA Vera Rubin NVL72 platform for engineering validation and design-in. This liquid-cooled, rack-scale architecture, integrating 72 NVIDIA Rubin GPUs and 36 NVIDIA Vera CPUs with 6th-generation NVIDIA NVLink, delivering breakthrough performance and efficiency for AI factories.
AMD Helios™ rackscale solution: Built on the Open Rack Wide (ORW) standard, AMD Helios brings together AMD Instinct™ MI450 Series GPUs, 6^th Gen AMD EPYC™ Server CPUs, AMD Pensando™ advanced networking technologies and AMD ROCm™ open software in a unified architecture for large-scale AI training and inference. Through close collaboration with AMD, Wiwynn is applying its rack integration and manufacturing expertise to bring this architecture to customers at scale with solutions tailored to CSP requirements.

Advanced Thermal Engineering: Pushing Beyond the Limits of Cooling

Wiwynn will showcase a full spectrum of forward-looking cooling innovations, from on-package cooling and advanced materials to system-level lightweight design, demonstrating its commitment to breaking through the physical limits of traditional cooling architectures.

Diamond-based Microchannel Cooling: Wiwynn is exploring diamond-based composite materials as a next-generation alternative to copper, demonstrating direct diamond-to-silicon bonding with integrated microchannel structures for on-package cooling. This leverages diamond's superior thermal conductivity to shorten the heat transfer path directly at the chip level.
6kW Double-Sided Cold Plate with Cavity PCBA and VPD: An ultra-thin double-sided cold plate with cavity PCBA design for high-power AI ASICs using Vertical Power Delivery, delivering 6kW cooling capacity, over15% thermal performance improvement, and up to 80% reduction in power delivery loss. This design simultaneously addresses thermal, power, and space constraints in next-generation AI modules.
Lightweight Cold Plate and Inner Manifold Design: Through reduced metal usage in cold plates and inner manifolds, along with lightweight tubing, Wiwynn cuts cooling component weight by at least 30%, streamlining integration, transportation, and installation for high-density AI racks as deployments scale worldwide.
Topology-Optimized Microchannel Cold Plate: Together with Corintis, Wiwynn will showcase topology-optimized microchannel designs tailored to chip power maps, targeting high heat flux regions while balancing thermal and hydraulic performance. This approach has the potential to further enhance cold plate performance for next-generation AI ASICs.

Overcoming Network Bottlenecks: CPO-Based Optical Interconnect

Wiwynn, together with ecosystem partners including Ayar Labs, Corning, GUC, and Senko, will showcase its co-packaged optics (CPO) scale-up rack solution, covering rack-level fiber routing, patch panel integration, and multi-vendor fiber management, alongside a live demonstration of optical engine telemetry. The demo highlights an open ecosystem approach and Wiwynn's ability to integrate optical, mechanical, cooling, and system-level innovations into a scalable rack-scale AI infrastructure platform.

Wiwynn's latest innovations will be explored in greater depth throughout the Summit, from Executive Track and Expo Hall Talk sessions to in-depth engineering workshops and the Future Technology Symposium.

Visit Wiwynn at Booth C74, San Jose Convention Center, and download the latest whitepapers to learn more about next-generation AI infrastructure and data center technologies.

About Wiwynn

Wiwynn is an innovative cloud IT infrastructure provider delivering high-quality computing, storage, and rack-level solutions for leading data centers worldwide. Guided by the vision to “unleash the power of digitalization; ignite the innovation of sustainability,” Wiwynn actively invests in next-generation technologies to deliver the best TCO, workload- and energy-optimized IT solutions from cloud to edge. Wiwynn’s end-to-end capabilities span server design, system integration, and high-volume L10/L11 rack delivery, backed by a manufacturing network spanning Taiwan, the United States, Mexico, Malaysia, and the Czech Republic.

For more information, please visit Wiwynn website, Facebook, and Linkedin.

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