As AI and high-performance computing (HPC) workloads continue to increase rack power density beyond the practical limits of conventional air cooling, liquid cooling has become a key technology for next-generation server platforms.
This paper presents a liquid-cooled server platform derived from a conventional 1U dual-socket air-cooled server to investigate the system-level design principles required for liquid-cooling integration. The study examines four complementary design aspects: serviceability-oriented mechanical design, system-level cooling strategy, Heat Capture Ratio (HCR) optimization, and reliability-oriented design. At a coolant inlet temperature of 40°C, the hybrid configuration achieved an HCR of approximately 70–80%, while the near-full liquid-cooled (fan less) configuration increased HCR to over 90% without additional liquid-cooling hardware. Achieving this required approximately 60% higher coolant flow than the hybrid configuration and correspondingly higher pump power, highlighting the cooling-resource trade-off associated with higher HCR. This paper further identifies the key design shifts, architectural evolution, and future design priorities for liquid cooled server platforms. Successful liquid-cooled server design requires effective system-level integration to achieve high HCR without disproportionate increases in cooling resources, implementation complexity, or cost.
Download the whitepaper to explore proven system-level architectures, trade-off analyses, and thermal benchmarks for deploying high-HCR liquid cooling across next-generation AI and HPC server platforms. Gain actionable engineering insights to optimize heat capture up to 90%+ without compromising pump power, mechanical serviceability, or overall infrastructure TCO.