The rapid scaling of AI workloads is pushing traditional copper interconnects beyond their practical limits in bandwidth density, reach, and power efficiency. Co-Packaged Optics (CPO) offers a path toward larger AI scale-up domains by enabling high-density optical connectivity beyond conventional rack boundaries.
This whitepaper presents a system-level perspective on deploying CPO-based AI infrastructure, focusing on the integration layer between device-level optical technologies and rack-to-rack deployment. A fiber-centric architectural framework is introduced to examine the key requirements for deployable optical scale-up infrastructure, including fiber architecture, interface standardization, operations, and serviceability. Together, these considerations establish a practical foundation for translating CPO innovation into scalable, manageable and deployable datacenter infrastructure.
Download the whitepaper to explore how a fiber-centric CPO architecture breaks through copper interconnect limits—delivering the bandwidth density, standardization, and serviceability required to scale AI clusters beyond the rack.