This white paper presents a system-level perspective on how CPO technology can be integrated into scalable AI server architectures. It first introduces the key CPO building blocks, with a focus on their functions, interconnections, and system-level implications.
Different implementations and combinations of these building blocks can introduce different requirements for thermal management, mechanical layout, component placement, space allocation, fiber routing, power delivery, and serviceability. Building on these considerations, this paper further explores how CPO technology can be physically integrated into L10 systems and scaled toward an all-to-all L11 architecture.
Through this component-to-system perspective, the paper provides architectural considerations and a practical reference for the development of next-generation AI systems utilizing CPO technology.
Download the white paper to explore system-level CPO integration blueprints for next-generation AI infrastructure—spanning critical thermal, power, and optical packaging trade-offs to scale from L10 server nodes to all-to-all L11 architectures.